Description:

The candidate will be responsible for conducting failure analysis needed identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.

Knowledge of packaging material property and behavior is beneficial.

Candidate should also demonstrate good communication skills, work well with a team, deliver under pressure, and well organized.

Preferred skills:

Demonstrated skills in X-section/planar polishing, Optical microscopy imaging, Labview and SEM imaging on printed circuit board are preferred.

Minimum Educational Requirement:

BS degree or higher in science or engineering and 8+ years’ experience in failure analysis, material analysis, process development or analytical tool development.

Education: Bachelors Degree

Additional client information: