IC Packaging Simulation Engineer
San Diego, California
Summary
Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result?
We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM simulation with multi-year FEM software ANSYS or ABAQUS. This position requires someone familiar with development process of simulation and characterization projects, that thrives in a multifaceted collaborative organization.
Key Qualifications
Proven capability in mechanics and mathematics.
Hands-on experience of major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.).
Proficiency with numerical simulation software tools and expert in Matlab and/or Scientific Python.
Deep understanding of packaging materials and their mechanical behaviors.
Knowledge of electronic packaging structures and processes, as well as its reliability, and package qualification requirements is a huge plus.
Able to perform independent research and development work.
Excellent written and verbal communication skills with ability to present ideas, design concepts, data and plan with high confidence at team meetings.
Description
- Numerical modeling of the stress and deformation of component packages to provide comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability.
- Programming CAD tools, FEM software, and numerical tools to set up automated model-generation user interfaces and maintain those codes.
Education & Experience
- BS and 3+ years of relevant industry experience.
Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result?
We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM simulation with multi-year FEM software ANSYS or ABAQUS. This position requires someone familiar with development process of simulation and characterization projects, that thrives in a multifaceted collaborative organization.
Key Qualifications
Proven capability in mechanics and mathematics.
Hands-on experience of major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.).
Proficiency with numerical simulation software tools and expert in Matlab and/or Scientific Python.
Deep understanding of packaging materials and their mechanical behaviors.
Knowledge of electronic packaging structures and processes, as well as its reliability, and package qualification requirements is a huge plus.
Able to perform independent research and development work.
Excellent written and verbal communication skills with ability to present ideas, design concepts, data and plan with high confidence at team meetings.
Description
- Numerical modeling of the stress and deformation of component packages to provide comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability.
- Programming CAD tools, FEM software, and numerical tools to set up automated model-generation user interfaces and maintain those codes.
Education & Experience
- BS and 3+ years of relevant industry experience.
Created: 2024-05-30
Reference: 200452155
Country: United States
State: California
City: San Diego
ZIP: 92109
About Apple
Founded in: 1976
Number of Employees: 154000
Website: https://www.apple.com/
Career site: https://www.apple.com/careers/us/
Wikipedia: https://en.wikipedia.org/wiki/Apple_Inc.
Instagram: https://www.instagram.com/apple/
LinkedIn: https://www.linkedin.com/company/apple
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