The mission of the Packaging Engineering team is to develop and launch world-class packaging to support Meta hardware. We work closely with a wide array of creative, technical and operations partners as we push the boundaries of what is possible. As a Packaging Engineer you'll provide engineering support for all packaging development activity for Meta hardware product portfolio. You have a passion for problem solving and love finding creative solutions. The products we work on help connect the world closer together and we contribute with each box we design.

Packaging Engineer, Reality Labs Devices Responsibilities

• Collaborate with Industrial Design, Hardware Engineering, Operations, and Technical Program Management to provide engineering support for packaging development


• Partner with ID to inform CMF, component level material spec, and provide engineering evaluation of packaging concepts


• Own engineering development and execution of final packaging design concepts


• Create Packaging drawings, assembly specs, SOPs and documentation


• Own DFMEA and develop offline experiments to improve manufacturability


• Assist in directing packaging vendors and internal partners to realize packaging solutions. Champion quality objectives and ensure adherence to specifications


• Drive package reliability execution and provide failure analysis of test results, partner with internal teams to develop viable solutions


• Provide cost feasibility of design options and innovate to align with cost targets


• Provide technical support to all manufacturing sites in implementing processes for product packaging


• Provide on-site support for manufacturing builds during new product development, owning OK2Ship from packaging vendors to contract manufacturers


• ~20% international and domestic travel

Minimum Qualifications

• Bachelor's degree in Mechanical Engineering, Packaging Engineering, Packaging Science or equivalent industry experience


• Understanding of shock, vibration, and the effect of temperature variation in product protection and package design


• Understanding of the following manufacturing/material processes: Rigid Box, Paper Pulp, Thermoforming, Corrugated, Labels, Foam, Shrinkwrap, Films, Adhesives


• Understanding of packaging manufacturing, printing, and production processes


• 2D and 3D CAD experience (Autocad, Solidworks, or NX)


• Understanding of ArtiosCAD, CAPE/TOPS, or other packaging design software

Preferred Qualifications

• 3+ years in package engineering development for consumer electronics


• Fluency in Mandarin


• Understanding of packaging material characteristics, behavior, and performance


• NX and Teamcenter experience


• Prototyping using Zund or Kongsberg cutting table

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