Job ID: 24-03155 Pay rate range - $48/hr. to $50/hr. on W2

Must Have
Micro soldering experience
Proficiency in using failure analysis laboratory equipment
Embedded, database or Python programming experience

Day to Day
Will be doing the first couple steps of failure analysis: make problem statements, read schematics and circuit layouts, talk with SMEs, basic testing and checks.

Job Description
As a member of the Ring Failure Analysis team, your primary responsibilities include root cause failure analysis of electronic, mechanical, and or electromechanical components including assemblies. You will work with other subject matter experts in video, motion sensing, power, and communication technologies to help improve the products and customer experience.
We are seeking candidates with practical knowledge of failure mechanisms related to Materials, Mechanical Systems, and/or Batteries, using the appropriate analytical tools including optical microscopes, real-time x-rays, scanning electron microscopes, chemical analysis equipment, and other testing and analysis tools.
Good interpersonal skills and oral and written communication skills are essential.
You will be required to multi-task and prioritize work to meet schedule and cost needs.

RESPONSIBILITIES
Responsible for collaborating with the Failure Analysis engineering team to identify and research failures down to a component level to improve product yield, quality and reliability.
Operation of lab equipment to support deep dive into issues as needed
SCH capture and Layout of simple PCB
Preparation of samples
Perform in-depth chemical, physical, or electromechanical failure analysis.
Perform PCBA debugging on RMA return, determine the root cause of failure, analyze failure reports, and recommend corrective action to prevent reoccurrence of problems.
Work with functional teams as needed to understand device issues.
Articulate conclusions to the team and advocate for appropriate action.
Read schematics and layouts, and apply failure analysis procedures to identify the failure location and the root causes
Write comprehensive failure analysis reports, including charts and photographs

BASIC QUALIFICATIONS
2+ years of relevant work experience with connected, electromechanical devices and debugging issues in production or in manufacturing
1+ years of embedded, database or Python programming experience
Proficiency in using failure analysis laboratory equipment including sample preparation tools, X-ray / CT, SEM/EDS, and optical microscopes
1+ years of micro-soldering experience is required
A bachelors degree in engineering is preferred, if have lots of technician experience in a lab setting.

Field quality and safety investigations,
The team has a big laboratory they work out of, and will need to be onsite for hands on work.

PREFERRED QUALIFICATIONS
Deep and up-to-date technical understanding of protocols and debugging methods for related technologies with prior experience both launching new product as well as driving continuous product improvements.
Demonstrated ability to achieve stretch goals across functional teams and ability to meet or exceed expected timelines for projects.
Ability to thrive in a startup environment.
Demonstrated ability to uncover systemic issues and drive failure analysis to root cause swiftly and accurately.
Ability to influence cross-functional teams and external partners.
Proficient with SQL, Excel & PowerPoint
Expertise with electronic test equipment (digital/analog) such as Logic analyzers, oscilloscopes, and test systems to do board failure analysis and debugging.
Excellent verbal and written communication skills are a must.
Meets/exceeds functional/technical depth and complexity for this role