Summary
Do you love working on challenges that no one has yet solved? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish.

We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device's thermal performance and participate in advanced IC packaging research and development.

Key Qualifications
Extensive experience in thermal analysis and modeling of System on Chip (SoC), IC packages and mobile devices.
Deep fundamental understandings on thermal conduction, convection and radiation.
Experience in modeling transient thermal response and reduced-order modeling.
Knowledge of semiconductor, package, PCB or mobile device design and thermal testing.
Experience working with IC physical design parameters affecting electrical and thermal performance of packaging technologies.
Knowledge of SoC design methodology, low-power techniques and thermal analysis methods.
Knowledge of advanced packaging assembly processes along with electrical and thermal characteristics of packages.
Ability to drive and lead cross-functional teams to execute on "design for thermal".
Tool Familiarity: Ansys Ice Pak, Sentinel-TI, Fluent, Cadence Allegro, Redhawk etc.
BS and 10+ years of relevant industry experience

Description
This position is responsible for: Architecting thermal solutions to address chip energy efficiency and performance scaling Providing thermal modeling solutions to mobile devices at silicon die and semiconductor package levels, Optimizing advanced IC design scheme/floor-planning to ensure good thermal performance Developing detailed and reduced-order thermal models Analyzing simulation and measurement results to enhance product thermal management

Education & Experience
BS and 10+ years of relevant industry experience

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