Hardware Engineer IV - RF Module

Sunnyvale, California


Employer: Insight Global
Industry: Electrical Engineering
Salary: Competitive
Job type: Part-Time

Own end-to-end RF module/SIP development for Meta products from concept to mass production.
Responsible for module/SIP technology selection, part selection, vendor evaluation, contract development, and performing cost/technology/performance analysis.
Develop module architecture, schematics, and layouts, and work with vendors for DFM and manufacturing.
Perform simulation (RF circuit simulation, 3D EM simulation, and thermal simulation), factory bring up, lab bench debug, performance tuning and optimization, and validation of RF modules/SIPs.
Design, simulate and validate advanced RF packaging/module/SIP
Collaborate closely with cross-functional teams and vendors to ensure RF performance is met at component, board, and system levels.
Evaluate new advanced packaging technology, including design and validation of prototypes.
Domestic/international travel to achieve program milestones.

We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment regardless of their race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or recruiting process, please send a request to HR@insightglobal.com .

To learn more about how we collect, keep, and process your private information, please review Insight Global's Workforce Privacy Policy: https://insightglobal.com/workforce-privacy-policy/ .

Required Skills & Experience

3+ years of experience in developing RF modules/SIPs, preferable in wireless consumer electronics or similar industries.
At least BSEE or BSc in related engineering discipline
Experience with advanced packaging technologies and RF module/SIP design
Experience in RF schematics, layouts, and DFM.
Work experience with RF lab equipment for device characterization, debug, and component/system performance validation.
Experience using circuit, EM, and thermal simulation tools such as Ansys HFSS, Keysight ADS/Momentum, Cadence Allegro, Cadence Virtuoso, Ansys Icepak, Flotherm.
Experience with developing RF test specifications and conducting RF lab testing with bench equipment (e.g. network analyzers, communication testers, spectrum analyzers, and oscilloscopes)

Nice to Have Skills & Experience

MS or PhD in EE with emphasis on advanced packaging or RF design
5+ years of relevant industry experience
Experience in RF design and RF advanced packaging technologies.
Experience with WiFi, BT, GPS, and cellular RF implementation.
Experience in bringing RF modules/SIPs to production
Familiar with regulatory requirements (FCC, CE, etc.).

Benefit packages for this role will start on the 31st day of employment and include medical, dental, and vision insurance, as well as HSA, FSA, and DCFSA account options, and 401k retirement account access with employer matching. Employees in this role are also entitled to paid sick leave and/or other paid time off as provided by applicable law.

Created: 2024-04-19
Reference: 351976
Country: United States
State: California
City: Sunnyvale
ZIP: 95002


Similar jobs: