IC Packaging Engineer

Summary
We are looking for a senior level electronic packaging engineer to work on developing exciting products. Be responsible for providing module packaging solutions in a system for various consumer markets. Working with the internal device design, product design, operation, and supply chain; and also, with the external suppliers to develop and deploy new packaging technologies. We are looking for individuals who are innovative with a proven track record to deliver in a high-volume manufacturing environment.



Description
Define new optical and MEMS module/package special characteristics based on the unique system level performance, cost, and footprint requirements.
Conduct initial package layout and architecture scoping and sign off the final package design.
Work with internal x-functional team and suppliers on FMEA, DFM, FEA and POC build. Identify risks/gaps, and carry out new material, equipment and process development.
Conduct fundamental bench materials characterization. Define new process control items and specs.
Conduct MP path readiness assessment, strong yield analysis and enhancement skills, strong FA and problem solving skills.
Define packaging roadmap based on long term packaged product requirements. Initiate and manage the supplier's pathfinding activities.
Strong x-functional influence and/or previous leadership demonstration.

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