Silicon photonics / Optical packaging engineer
Santa Clara, California
Summary
Silicon photonics (SiPh) technology is essential for realizing next-generation optical interconnects already implemented in data center connectivity and ready to penetrating into short distance within the boards. One critical technology to realize high-volume, low-cost SiPh optical interconnect applications is the development of high efficient optical I/O module architecture, assembly, optical coupling design and process for single-mode fiber packaging. We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost.
Description
Responsible to lead Si photonics packaging technology development. Work with cross functional team and lead optical engine module, optical coupling design/fiber array connector and co-packaging optics development efforts. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM. Minimum 5% International travel.
Silicon photonics (SiPh) technology is essential for realizing next-generation optical interconnects already implemented in data center connectivity and ready to penetrating into short distance within the boards. One critical technology to realize high-volume, low-cost SiPh optical interconnect applications is the development of high efficient optical I/O module architecture, assembly, optical coupling design and process for single-mode fiber packaging. We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost.
Description
Responsible to lead Si photonics packaging technology development. Work with cross functional team and lead optical engine module, optical coupling design/fiber array connector and co-packaging optics development efforts. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM. Minimum 5% International travel.
Created: 2024-09-29
Reference: 200569817
Country: United States
State: California
City: Santa Clara
ZIP: 95054
About Apple
Founded in: 1976
Number of Employees: 154000
Website: https://www.apple.com/
Career site: https://www.apple.com/careers/us/
Wikipedia: https://en.wikipedia.org/wiki/Apple_Inc.
Instagram: https://www.instagram.com/apple/
LinkedIn: https://www.linkedin.com/company/apple
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