Summary
Do you love working on challenges that no one has solved yet? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. In this role, you will own and drive the electrical and physical design of multi-layer boards for prototype systems, developing reference designs that meet stringent area, cost, and performance requirements for product development.

Key Qualifications
4+ years experience in physical design of multi-layer boards (MLBs)
Experience in circuit design, schematic capture, and system integration
Strong physical understanding of power and signal integrity fundamentals
Experience in the physical design of Power Delivery Networks (PDNs) and high-speed signals at PCB level
Familiar with Cadence APD/Allegro for physical design
Familiar with High Density Interconnect (HDI) PCB and Flip-Chip (FC) BGA package substrate technologies
Ability to work and communicate effectively in a multi-functional team

Description
Work with cross-functional team to understand system requirements, from both physical design limitations and performance requirements Develop physical design implementations meeting stringent power and signal integrity requirement Drive co-optimization of physical design on MLB and package Provide implementation guidelines and feedback to silicon, package, and system design groups Perform feasibility study, design verification, and sign-off

Education & Experience
BS and 3+ years of relevant industry experience

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