IC Package Design Engineer

Summary
Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new insights have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish!

Our Hardware Technology Packaging team invents, designs, develops and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV, etc.

In this highly visible role, you will own and drive sophisticated package selection, new generation product package structure and configuration optimization. You will be responsible for Package/SIP/module physical design and layout, optimization, DV and tape out; and work with multi-functional teams to achieve optimized mechanical/electrical/ thermal performance for various types of chips.



Description
- Implement the physical design of packages and modules for SoC, Memory, RF and cellular chips.
- Interface and coordinate with multi-functional groups throughout Apple on new product package/SiP/module feasibility analysis, design and selection.
- Define and develop design verification and automation strategy to strengthen and streamline package design as well as release flows.
- Work multi-functionally to optimize package pin out.
- Perform extraction of S-parameters and package RLGC model.
- Ensure package design is optimized with SI/PI requirements.
- Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.
- Explore, evaluate and develop new CAD tool, design and verification flow.
- Partner with Silicon PD team to optimize chip Floorplan and bump placement, and minimize package size.

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