At Reality Labs Research (RL-R), our goal is to explore, innovate and design novel interfaces and hardware subsystems for the next generation of virtual, augmented, and mixed reality experiences. We are seeking a skilled and motivated Process Engineer to join our team, whose mission is to innovate on tools, materials and processes to help accelerate and de-risk the development of future soft wearable technologies. We are specifically looking for a candidate with experience in process engineering related to micro- or nanofabrication, MEMS, and/or advanced packaging technologies with aptitude in design/layout, process development, execution of design of experiments, and/or process integration. You will collaborate with a diverse and highly interdisciplinary team of exceptional researchers and engineers and will have access to cutting edge technology, resources, and testing facilities. We seek people who work well on teams, can brainstorm and communicate big ideas, and can plan and drive development activities.

Process (Integration) Engineer Responsibilities

• Innovate processes for fabrication of novel devices and advanced packaging solutions for flexible/stretchable integration of electronic components, devices, and systems


• Design experiments for development, evaluation and yield enhancement of processes to develop Best Known Methods (BKMs) that will be leveraged for prototype development


• Partner and collaborate with researchers, hardware engineers, device and systems integration teams, and external partners to push development beyond state-of-the-art


• Design, execute, and oversee internal, external, and hybrid manufacturing integration workflows to mature, document, track process stability, and deliver research prototypes


• Contribute new technologies and methods innovation to close critical capability gaps

Minimum Qualifications

• B.S. or equivalent degree or comparable experience in field of Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Applied Physics, Aerospace Engineering, or related field


• 2+ years experience in process engineering focused on micro- or nanofabrication, MEMS, advanced packaging and/or related technologies to include, but not limited to, wet/dry etch, chemical vapor deposition (CVD), physical vapor deposition (PVD), electrochemical deposition (ECD), photolithography, metrology, back-end-of-line (BEOL), surface mount technology (SMT), laser machining, micro-molding and/or similar fabrication processes


• Demonstrated 2+ successful outcomes in process development and fabrication in a development or production environment, including, but not limited to, optimization of a single process, utilization of test and characterization methods and instruments for validation, electrical schematic design, physical layouts, mechanical design, and/or related outcomes


• 2+ years of experience in development and/or use of high performance electronic materials

Preferred Qualifications

• Advanced degree in field of Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Applied Physics, Aerospace Engineering, or related field


• Experience using Electronic Design Automation (EDA) tools in design and subsequent fabrication of advanced packaging technologies including flexible printed circuits (FPC), printed circuit board (PCB) and/or redistribution layers (RDL), wafer-level packaging (WLP), system-in-package (SiP), flexible hybrid electronics (FHE) or similar technology


• Either depth of expertise in a specific fabrication technology area or experience in process integration that leverages a breadth of process experience from front-end to BEOL with a demonstrated record of leveraging expertise to build devices, circuits, and/or systems


• Working experience with metrology equipment and processes, to include but not limited to, scanning electron microscopy (SEM), focused ion beam (FIB) cross-section, ellipsometry/reflectometry, automated optical inspection (AOI), atomic force microscopy (AFM), confocal & optical microscopy/inspection, contact and non-contact profilometry, scanning acoustic microscopy (SAM), or similar techniques


• Practical experience in substrate bonding and debonding, hermetic sealing, MEMS packaging, compression molding, transfer molding, planarization, or similar technologies

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